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PRELIMINARY DATA SHEET
SKY65329-NP: 900 MHz Front-End Module
Applications
* Paging * Remote metering * WLL and ISM transmitters
Description
Skyworks SKY65329-NP is a fully matched, high-efficiency RF Front-End Module (FEM) with 900 MHz transmit and receive paths. There are also routing switches to connect auxiliary broadband signals between the RFIC and antenna ports. By using three control signals (CTRL1, CTRL2, and PWR_DOWN), the module can be configured to one of five operational modes (900 MHz transmit, 900 MHz receive, auxiliary RF bypass, auxiliary power, or power down). The 900 MHz transmit path consists of an harmonic filter and high efficiency Power Amplifier (PA). The 900 MHz receive path contains a low-power Low-Noise Amplifier (LNA). Both the PA and LNA can be switched to power-down mode for low leakage current. The auxiliary RF path is a low-loss, broadband, bidirectional RF path that allows easy switching of signal between the RFIC and the antenna port. Breakout ports are available for adding external filters. Switchable auxiliary power can supply up to 10 mA of VDD power to external circuitry through pin 26 (VDD_OUT). The SKY65329-NP is manufactured with advanced InGaP HBT and silicon CMOS processes, which provide a positive DC voltage supply while maintaining high efficiency and good linearity. The device is mounted in a 28-pin, 8 x 8 mm MCM SurfaceMounted Technology (SMT) package, which allows for a highly manufacturable low-cost solution. A block diagram of the SKY65329-NP is shown in Figure 1. The device package and pinout for the 28-pin MCM are shown in Figure 2.
Features
* 900 MHz transmit saturated output power > 24 dBm * 900 MHz high efficiency PA and LNA * Auxiliary bidirectional broadband RF path * Internal switching and control circuits * Internal RF match and bias circuits * Internal DC block on RF ports * Externally adjustable bias setting * Single DC supply = 3.6 V * Small footprint, MCM (28-pin, 8 x 8 mm) Pb-free (MSL3, 260 C per JEDEC J-STD-020) SMT package
Filter 1
Filter 2
Harmonic Filter
Bidirectional RF Port
Switch A Switch B LNA
PA
Antenna Port
Switch D Switch C
Filter 3
Filter 4
S1336
Figure 1. SKY65329-NP Block Diagram
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PRELIMINARY DATA SHEET * SKY65329-NP TRANSMIT/RECEIVE FRONT-END MODULE
PWR_DOWN FLT4_O GND RFIO GND FLT1_I GND FLT1_O
VDD_CONT
VDD_OUT
VCC_PA
CTRL1
CTRL2
VREF
1 2 3 4 5 6 7 8
28
27
26
25
24
23
22 21 20 19 18 17 16
GND GND ANT GND FLT3_I FLT4_I GND FLT3_O
9
10
11
12
13
14
15
GND
FLT2_O
GND
FLT2_I
LNA_BIAS_R
VCC_LNA
S1337
Figure 2. SKY65329-NP Pinout - 28-Pin MCM (Top View)
Table 1. SKY65329-NP Control Logic
Configuration CTRL1 Auxiliary power 900 MHz receive 900 MHz transmit Auxiliary RF bypass Power down
Note: Logic level 0: 0 V to 0.3 V Logic level 1: 2.5 V to VCC.
Logic Input Control Bits CTRL2 0 1 0 1 X PWR_DOWN 0 0 0 0 1 PA Off Off On Off Off
States LNA Off On Off Off Off VDD Output On Off Off Off Off
0 0 1 1 X
Technical Description
The SKY65329-NP provides input and output amplifier stages and is internally matched for optimum efficiency. An active bias circuit provides both input and output stages with excellent gain tracking over temperature and voltage variations. The module operates with positive DC voltages, and maintains high efficiency and good linearity. The nominal operating voltage is 3.6 V for maximum power, but the device can be operated at slightly lower voltages for other mobile applications. Operational Modes By using three control signals (CTRL1, CTRL2, and PWR_DOWN), the module can be configured to one of five operational modes:
Auxiliary power. In this mode, the PA and LNA are off and the VDD_OUT signal (pin 26) can be used for auxiliary power, which can supply up to 10 mA of VDD power to external circuitry. 900 MHz receive. In this mode, the SKY65329-NP amplifies the received signal at the antenna port through the LNA. 900 MHz transmit. In this mode, the transmit path provides an harmonic filter and high efficiency PA. Auxiliary RF bypass. In this mode, a low-loss broadband bidirectional RF path allows easy switching of the signal between the transceiver and the antenna port. Power down. In this mode, the PA and LNA are powered down for minimal current consumption and low leakage current (5 A). Table 1 provides the control logic for each of the five operational modes.
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PRELIMINARY DATA SHEET * SKY65329-NP TRANSMIT/RECEIVE FRONT-END MODULE
Electrical and Mechanical Specifications
Signal pin assignments and functional pin descriptions are described in Table 2. The absolute maximum ratings of the SKY65329-NP are provided in Table 3. The recommended operating conditions are specified in Table 4 and electrical specifications are provided in Table 5.
related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The SKY65329-NP is rated to Moisture Sensitivity Level 3 (MSL3) at 260 C. It can be used for lead or lead-free soldering. For additional information, refer to Skyworks Application Note, PCB Design and SMT Assembly/Rework Guidelines for MCM-L Packages, document number 101752. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. Production quantities of this product are shipped in a standard tape and reel format. For packaging details, refer to the Skyworks Application Note, Tape and Reel, document number 101568.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is baked and vacuum packed before shipping. Instructions on the shipping container label regarding exposure to moisture after the container seal is broken must be followed. Otherwise, problems
Table 2. SKY65329-NP Signal Descriptions
Pin # 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Name PWR_DOWN FLT4_O GND RFIO GND FLT1_I GND FLT1_O GND FLT2_O GND FLT2_I LNA_BIAS_R VCC_LNA Power down Filter 4 output port Ground RF input/output (internally DC blocked) Ground Filter 1 input port Ground Filter 1 output port Ground Filter 2 output port Ground Filter 2 input port LNA bias resistor LNA collector voltage Description
Pin # 15 16 17 18 19 20 21 22 23 24 25 26 27 28
Name FLT3_O GND FLT4_I FLT3_I GND ANT GND GND VDD_CONT VREF VCC_PA VDD_OUT CTRL2 CTRL1
Description Filter 3 output port Ground Filter 4 input port Filter 3 input port Ground Antenna port (internally DC blocked) Ground Ground CMOS controller supply voltage PA bias reference voltage PA collector voltage Auxiliary supply Control 2 Control 1
Table 3. SKY65329-NP Absolute Maximum Ratings (Note 1)
Parameter Supply voltage Transmit input power Receive input power Supply current Power dissipation Case operating temperature Storage temperature Junction temperature VCC PIN_TX PIN_RX ICC PDISS TC TST TJ -40 -55 +85 +125 +150 Symbol Minimum Maximum 4 Units V dBm dBm mA W C C C
Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value.
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PRELIMINARY DATA SHEET * SKY65329-NP TRANSMIT/RECEIVE FRONT-END MODULE
Table 4. SKY65329-NP Recommended Operating Conditions
Parameter Supply voltage Frequency range Auxiliary frequency range Transmit input power range Case operating temperature Storage temperature VCC f fAUX PIN TC TST Symbol Minimum 2.8 902 400 -3 -40 -55 Typical 3.6 Maximum 3.8 928 2500 -1 +85 +125 Units V MHz MHz dBm C C
Table 5. SKY65329-NP Electrical Specifications (VCC = 3.6 V, TC = +25 C, External PA VCC Bias Resistor [R28] = 2 k, Unless Otherwise Noted)
Parameter General Return loss Thermal resistance Auxiliary Power Mode Auxiliary power VCC Ext Load current < 10 mA VCC - 0.1 VCC V RL JC All RF ports except ANT in transmit mode, 50 12 22 dB C/W Symbol Test Condition Min Typical Max Units
900 MHz Receive Mode (0 Between FLT1_I/FLT1_O and FLT3_I/FLT3_O Pins in Place of External Filters) Small signal gain Noise Figure Input 1dB compression Input IP3 Operating current GSS (Rx) NF (Rx) IP1dB (Rx) IIP3 IOP (Rx) CW Two -30 dBm CW tones POUT = IP1dB (Rx) CW 18.5 2.0 -13 -2 4.5 dB dB dBm dBm mA
900 MHz Transmit Mode (0 Between FLT1_I/FLT1_O and FLT2_I/FLT2_O Pins in Place of External Filters) Saturated output power PSAT CW, PIN = -3 dBm CW, PIN = -1 dBm Saturated output power cold droop (Note 1) Small signal gain Noise Figure Power Added Efficiency DPSATCold GSS (Tx) NF (Tx) PAE CW, VCC = 2.8 V, TC = -40 C CW CW CW, PIN = -3 dBm CW, PIN = -1 dBm 2 harmonic 3rd to 8th harmonic Operating current
nd
+21.0
+24.3 +24.9 2 28 7.5 48.0 48.6 -39 -66 150 167 -30 -60 3
dBm dBm dB dB dB % % dBc dBc mA mA dB
Pf2 Pf3 to Pf8 IOP (Tx)
CW, PIN = -3 dBm CW, PIN = -3 dBm CW, PIN = -3 dBm CW, PIN = -1 dBm
Output return loss
ORL (Tx)
CW, PIN = -3 dBm
8
Auxiliary RF Bypass Mode (0 Between FLT4_I and FLT4_O Pins in Place of External Filters) 450 MHz loss FEM Power-Down Mode Leakage current ILEAK No RF input 0.2 A IL (Aux) f = 450 MHz 1.5 2.5 dB
Note 1: Saturated transmit output power cold droop is defined as the drop in PSAT at VCC = 2.8 V and TC = -40 C relative to PSAT at VCC = 3.6 V and TC = +25 C.
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PRELIMINARY DATA SHEET * SKY65329-NP TRANSMIT/RECEIVE FRONT-END MODULE
Evaluation Board Description
The SKY65329-NP Evaluation Board is used to test the performance of the SKY65329-NP FEM. The Evaluation Board schematic diagram is shown in Figure 3. An assembly drawing for the Evaluation Board is shown in Figure 4 and the layer detail is provided in Figure 5. The layer detail physical characteristics are noted in Figure 6. Table 6 provides the Bill of Materials (BOM) list for Evaluation Board components. The four external filters shown in Figure 3 are configured as throughputs so that the device can be tested immediately. External resistors are installed with values that allow the unit to operate immediately with the electrical specifications provided in Table 4. Refer to the SKY65329 T/R FEM Evaluation Board Information Application Note (document # *** TBD ***) for additional testing information. The digital ground pin of the SKY65329-NP (pin 22) is not connected to the other ground pins internally. Therefore, an external common ground connection is needed. If this is not provided, the digital controller may operate at a different potential than the RF section, which could damage the part. The separate digital ground pin allows flexibility when connecting the ground between the digital and RF sections of the device. This connection is through resistor R21 and capacitor C11 (loaded with a 0 resistor by default). If RF isolation is desired between the digital and RF sections, an appropriate component may be placed instead. Pin 16 of connector P1 is used to connect the source of the digital controls to a common ground point with the test fixture through components R21 and C11. Circuit Design Considerations The following design considerations are general in nature and must be followed regardless of final use or configuration: 1. Paths to ground should be made as short as possible.
2. The ground pads of the SKY65329-NP have special electrical and thermal grounding requirements. These pads are the main thermal conduit for heat dissipation. Since the circuit board acts as the heat sink, it must shunt as much heat as possible from the device. Therefore, design the connection to the ground pad to dissipate the maximum wattage produced by the circuit board. Multiple vias to the grounding layer are required. 3. Two external output bypass capacitors (0.022 F and 22 F) are required on pin 25 (VCC_PA). The same two capacitor values are also required on pin 14 (VCC_LNA). The capacitors should be placed in parallel between the supply line and ground. 4. Pins 14 and 25 (VCC_LNA and VCC_PA, respectively) may be connected together at the supply. NOTE: A poor connection between the slug and ground increases junction temperature (TJ), which reduces the lifetime of the device.
Package Dimensions
The phone board layout footprint for the SKY65329-NP is shown in Figure 7. Package dimensions for the 28-pin MCM are shown in Figure 8, and tape and reel dimensions are provided in Figure 9.
Electrostatic Discharge (ESD) Sensitivity
The SKY65329-NP is a static-sensitive electronic device. Do not operate or store near strong electrostatic fields. Take proper ESD precautions.
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PRELIMINARY DATA SHEET * SKY65329-NP TRANSMIT/RECEIVE FRONT-END MODULE
P1
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
VCC_LNA
PA_VCC_SENSE
GND (Digital)
PWR_DOWN
VDD_OUT
CTRL2
CTRL1
VCC_PA
VDD_CONT
R4 0 C4 2200 pF
VDD Output
Control Voltage 2
R2 0 C3 2200 pF R28 2000 C9 2200 pF C10 22 F C8 DNI R22 0 C12 2200 pF R21 0 C11 DNI
50 Transmission Line
PA VCC Sense PA VCC
Control Voltage 1
R3 0
VDD Controller
C2 2200 pF R1 0 C1 2200 pF
28
27
26
25
24
23
VDD_OUT
VREF
Power Down
1 2 3
VDD_CONT
CTRL1
CTRL2
VCC_PA
PWR_DOWN FLT4_O GND
GND GND
22 21
Digital Ground
J8
ANT 20
Antenna
J1
50 Transmission Line
4 RFIO 5 6 7 GND FLT1_I
SKY65329-NP
GND 19 FLT3_I FLT4_I 18 17 16
LNA_BIAS_R
GND
GND
GND
GND
50 Transmission Line
FLT2_I
J2
R7 0 R8 DNI R9 DNI
FLT2_O
50 Transmission R5 Line DNI
8 FLT1_O
VCC_LNA
FLT3_O 15
50 Transmission R16 Line DNI
R6 DNI J3
R18 0
R20 50 Transmission Line DNI J6 R19 DNI J7
9
10
11
12
13
14
R15 5600
R17 DNI
J4
50 Transmission R10 Line DNI
R12 0
R14 DNI R13 DNI
50 Transmission Line
LNA VCC
C6 2200 pF C7 DNI C5 22 F
R11 DNI J5
J10
50 Transmission Line
R23 DNI R24 DNI
R25 0
R27 DNI R26 DNI
50 Transmission Line
J9
Note: Some component labels may be different than the corresponding component symbol shown here. Component values, however, are accurate as of the date of this Data Sheet.
S1342
Figure 3. SKY65329-NP Evaluation Board Schematic
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PRELIMINARY DATA SHEET * SKY65329-NP TRANSMIT/RECEIVE FRONT-END MODULE
J10
J9
J1
J8
R26 R24
C8
R27
R25
R23
J2
J7
R28
R19
R5 R6 R8 R7 R9 R15
R10 R11 R13 R14
R18 R17
R16 C6 C7 R12
J3
J6
C10 C1 C2 C3 C4 C12 C11
R22 R21
J4
C5
R1 R2 R3 R4
J5
P1
S1343
Figure 4. SKY65329-NP Evaluation Board Assembly Drawing
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PRELIMINARY DATA SHEET * SKY65329-NP TRANSMIT/RECEIVE FRONT-END MODULE
Layer 1: Top - Metal
Layer 2: Ground
Layer 3: Power Plane
Layer 4: Solid Ground Plane
S1344
Figure 5. SKY65329-NP Evaluation Board Layer Detail
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PRELIMINARY DATA SHEET * SKY65329-NP TRANSMIT/RECEIVE FRONT-END MODULE
Cross Section
Name Thickness (mm) Material
L1 Lam1 L2 (GND) Lam2 L3 (GND) Lam3 L4 0.0356 0.3048 0.0356 0.1016 0.0356 0.3048 0.0356 Cu Rogers 4003-1 Cu 1 oz FR4 Cu 1 oz FR4-12 Cu 1 oz
r
- 3.38 - 4.35 - 4.35 -
S1339
Figure 6. Layer Detail Physical Characteristics
Table 6. SKY65329-NP Evaluation Board Bill of Materials
Component C1, C2, C3, C4, C6, C9, C12 C5, C10 R1, R2, R3, R4, R7, R12, R18, R21, R22, R25 R28 R15 C7, C8, C11, R5, R6, R8, R9, R10, R11, R13, R14, R16, R17, R19, R20, R23, R24, R26, R27 Quantity 7 2 10 1 1 19 Size 0402 0805 0402 0402 0402 N/A Value 2200 pF 22 F 0 2000 5600 DNI Vendor Murata Murata Yageo Yageo Yageo N/A Part Number GRM155R71H222KA01 GRM21BR60J226KA11 RC0402JR-*18RL RC0402JR-*2KL RC0402JR-*5K6L N/A
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PRELIMINARY DATA SHEET * SKY65329-NP TRANSMIT/RECEIVE FRONT-END MODULE
8.3
Stencil Aperture Size For Center Ground Pad Should Be 80% to 100% (By Area) of the Solder Mask Opening of the Package
0.15
0.75 0.65 0.05
0.85 12X 0.063 8.3 36X 0.875
0.951
Stencil and Metallization Soldermask Opening
24X 0.125 SMT Pad Detail Scale: 2X 6X This Rotation 6X Rotated 180o 6X Rotated 90o CW 6X Rotated 90o CCW
Component Outline
Component Outline
12X 0.063 24X 0.125 36X 0.875 8.4 5.875
Stencil Aperture Top View
2X 1.15 2X 0.15 2X 0.15 0.05 All Around
8.4
5.875
Stencil and Metallization Component Outline
Soldermask Opening
2X 0.85 2X 0.95 SMT Pad Detail Scale: 2X 1X This Rotation 1X Rotated 180o 1X Rotated 90o CW 1X Rotated 90o CCW
Component Outline
Solder Mask Opening Top View
Pin 28 2X 3.725 Pin 1
8.3
2X 3.725
Thermal Via Array. 0.3 mm on 0.6 mm pitch. Additional vias in common ground pad will improve thermal and electrical performance NOTE: thermal vias should be tented and filled with solder mask, 30-35 m Cu plating recommended.
8.3
4X 0.5 (1.2)
1.0 Pitch Typ
Component Outline
(1.2) 0.25 Typ
Metallization Top View
Note: The cross-hatched area represents the merger of the center ground pad +8 individual I/O ground pads. All I/O ground pads should have at least one via connected to internal ground planes for optimum electrical performance. All measurements are in millimeters
S1340
Figure 7. SKY65329-NP Phone Board Layout Footprint
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PRELIMINARY DATA SHEET * SKY65329-NP TRANSMIT/RECEIVE FRONT-END MODULE
16X 3.9
16X 1.5
16X 2.5
16X 0.5
See Detail D Pin 28 Pin 1 Indicator (See Detail C) Pin 1
Pin 1 Indicator
8
B C
16X 3.9 16X 2.5 16X 1.5
A
0
8
16X 0.5
A 1.05 0.1
0.15 A B C
0.1
28X SMT Pad 0.1 A B C
B
0 36X Solder Mask Openings
0.2 ABC
Top View
Side View
Metal Pad All Edges 2X 0.6 0.05
Bottom View
0.875 0.2 x 0.2 2X (0.1) 0.875 0.875 Soldermask Edges Soldermask Edges
0.6 0.05 (0.1) 3X (0.05) 0.75 0.05 0.65 0.05 Metal Pad All Edges
0.875
4X (0.05) 2X 0.8 0.05
Detail A
Pad Scale: 2X
6X This rotation 6X Rotated 180o 6X Rotated 90o CW 6X Rotated 90o CCW
Detail B
Pad Scale: 2X
1X This rotation 1X Rotated 180o 1X Rotated 90o CW 1X Rotated 90o CCW
Detail C
Scale: 2X
35 X Detail D
Scale: 2X
All measurements are in millimeters Dimensioning and tolerancing according to ASME Y14.5M-1994
S1341
Figure 8. SKY65329-NP 28-Pin MCM Package Dimensions
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PRELIMINARY DATA SHEET * SKY65329-NP TRANSMIT/RECEIVE FRONT-END MODULE
0.30 0.05
12.00 Pin #1 indicator
2.00 0.05 4.00 1.55 0.05 1.75 0.10
B
5o
7.50 0.05
1.50 Min. 5o
A
A
8.35
B
1.70
B
Notes: 1. Carrier tape: black conductive polystyrene 2. Cover tape material: transparent conductive PSA 3. Cover tape size: 13.3 mm width 4. All dimensions are in millimeters 5. Pin 1 orientation is in top left corner for the following Skyworks products: SKY74963-xx CX74063-35 SKY77503-xx SKY77506-xx SKY77512-xx SKY77526-xx SKY77343-xx For all other 8 x 8 mm MCM/RFLGA products, pin 1 orientation is in top right corner.
8.35
A
S1290
Figure 9. SKY65329-NP 28-Pin MCM Tape and Reel Dimensions
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16.00 0.03
PRELIMINARY DATA SHEET * SKY65329-NP TRANSMIT/RECEIVE FRONT-END MODULE
Ordering Information
Model Name SKY65329-NP 900 MHz Front-End Module Manufacturing Part Number SKY65329-NP (Pb-free package) Evaluation Kit Part Number TW17-D390
Copyright (c) 2009 Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. ("Skyworks") products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes. No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks Terms and Conditions of Sale. THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A PARTICULAR PURPOSE OR USE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT; ALL SUCH WARRANTIES ARE HEREBY EXPRESSLY DISCLAIMED. SKYWORKS DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO ANY SPECIAL, INDIRECT, INCIDENTAL, STATUTORY, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THE MATERIALS OR INFORMATION, WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE. Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury, death, physical or environmental damage. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale. Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters. Skyworks, the Skyworks symbol, and "Breakthrough Simplicity" are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands and names are for identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at www.skyworksinc.com, are incorporated by reference.
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